Main Products
ID Diamond Slicing Blades
Edge Grinding Wheels
O.D. Diamond Wheels (Bonded/Resin/Plated)
Diamond Tools and Products
Cut-Off Wheels
Band Saw
Core Drills
Dressing Stones Semiconductor Materials, Inc (SMI), patented multi-layered diamond I.D. slicing blades are specifically designed and manufactured to maximize wafer yields in all types of semiconductor materials.

Only the finest 100% natural virgin DeBeers diamonds are used to minimize wafer surface and subsurface damage.

The I.D. Diamond Blade and its high speed, creep resistant core materials is specifically manufactured to allow higher tensioning, minimizing blade bow, saw marks, and exit chipping.

PATENTS
All blades, except the Mark VIII are manufactured under U.S. Patents 3205624, 3488892, 3640027 and other corresponding foreign patents.