ID Diamond Blades

Semiconductor Materials, Inc(SMI), patented multi-layered diamond I.D. slicing blades are specifically designed and manufactured to maximize wfer yields in all types of semiconductor materials.

Only the finest 100% natural virigin DeBeers diamonds are used to minimize wafer surface and subsurface damage.

The SMI I.D. Blade and its high speed, creep resistant core materials is specifically manufactured to all higher tensioning, minimizing blade bow, saw marks and exit chipping

PATENTS

All blades, except the Mark VIII are manufactured under U.S. Patents 3205624, 3488892, 3640027 and other corresponding foreign patents.

Diamond Size Availability:
SMI is using a standard range from 60 grt to 500 grit. On request special blends of grit sizes are available. Models & Standard Blends

For Slicing Silicon
-SMI MARK III 2/1 270/325
-SMI MARK III 1/1 325/400

Gallium Arsenide Gemanium
-SMI MARK IV 1/3 400/500 (equal to MARK III 1/3)

For GGG, Quartz, Ferrites, Sapphire, Magnets, Ceramic
-SMI MARK V 80,100,120, 140, 170, 200, 230