Services

Main Products

• ID Diamond Slicing Blades    • Edge Grinding Wheels    • O.D. Diamond Wheels (Bonded/Resin/Plated)    • Diamond Tools and Products    • Cut-Off Wheels    • Band Saw    • Core Drills    • Dressing Stones

Semiconductor Materials, Inc (SMI), patented multi-layered diamond I.D. slicing blades are specifically designed and manufactured to maximize wafer yields in all types of semiconductor materials.

Only the finest 100% natural virgin DeBeers diamonds are used to minimize wafer surface and subsurface damage.

The I.D. Diamond Blade and its high speed, creep resistant core materials is specifically manufactured to allow higher tensioning, minimizing blade bow, saw marks, and exit chipping.